Resist multilayer film-attached substrate and patterning process
US-10514605-B2 · Dec 24, 2019 · US
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 65229385 |
| Family type | — |
| Earliest priority | Aug 4, 2017 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10514605B2 — Resist multilayer film-attached substrate and patterning process |
Best representative member for this family based on priority and filing country.
US10514605B2 — Resist multilayer film-attached substrate and patterning process (published Dec 24, 2019)
Related publications in this family.