FINFET Device with Wrapped-Around Epitaxial Structure and Manufacturing Method Thereof
US-2025169159-A1 · May 22, 2025 · US
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Patent family 64315580
This patent family groups 6 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 64315580 |
| Family type | — |
| Earliest priority | Aug 28, 2017 |
| First filing country | US |
| Member publications | 6 |
| Countries | US |
| Representative publication | US2025169159A1 — FINFET Device with Wrapped-Around Epitaxial Structure and Manufacturing Method Thereof |
Representative publication
Best representative member for this family based on priority and filing country.
US2025169159A1 — FINFET Device with Wrapped-Around Epitaxial Structure and Manufacturing Method Thereof (published May 22, 2025)
Member publications
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FinFET device with wrapped-around epitaxial structure and manufacturing method thereof
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