Wafer to wafer bonding techniques for III-V wafers and CMOS wafers
US-10134945-B1 · Nov 20, 2018 · US
This page is not indexed by search engines while we improve data quality.
Patent family 64176621
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 64176621 |
| Family type | — |
| Earliest priority | Aug 28, 2017 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US10134945B1 — Wafer to wafer bonding techniques for III-V wafers and CMOS wafers |
Representative publication
Best representative member for this family based on priority and filing country.
US10134945B1 — Wafer to wafer bonding techniques for III-V wafers and CMOS wafers (published Nov 20, 2018)
Member publications
Related publications in this family.