Electronic sensors with sensor die in package structure cavity
US-12187601-B2 · Jan 7, 2025 · US
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Patent family 62488479
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 62488479 |
| Family type | — |
| Earliest priority | Dec 8, 2016 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US12187601B2 — Electronic sensors with sensor die in package structure cavity |
Representative publication
Best representative member for this family based on priority and filing country.
US12187601B2 — Electronic sensors with sensor die in package structure cavity (published Jan 7, 2025)
Member publications
Related publications in this family.
Electronic sensors with sensor die in package structure cavity
US-2019144267-A1 · May 16, 2019 · US
Electronic sensors with sensor die in package structure cavity
US-10179730-B2 · Jan 15, 2019 · US
Electronic sensors with sensor die in package structure cavity
US-2018162722-A1 · Jun 14, 2018 · US