Selective metal removal for conductive interconnects in integrated circuitry
US-12176214-B2 · Dec 24, 2024 · US
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 61760865 |
| Family type | — |
| Earliest priority | Sep 30, 2016 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US12176214B2 — Selective metal removal for conductive interconnects in integrated circuitry |
Best representative member for this family based on priority and filing country.
US12176214B2 — Selective metal removal for conductive interconnects in integrated circuitry (published Dec 24, 2024)
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