Polymer film stencil process for fan-out wafer-level packaging of semiconductor devices
US-10617010-B2 · Apr 7, 2020 · US
This page is not indexed by search engines while we improve data quality.
Patent family 61244226
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 61244226 |
| Family type | — |
| Earliest priority | Aug 29, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10617010B2 — Polymer film stencil process for fan-out wafer-level packaging of semiconductor devices |
Representative publication
Best representative member for this family based on priority and filing country.
US10617010B2 — Polymer film stencil process for fan-out wafer-level packaging of semiconductor devices (published Apr 7, 2020)
Member publications
Related publications in this family.