Method for depositing a layer using a magnetron sputtering device
US-10407767-B2 · Sep 10, 2019 · US
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Patent family 61197626
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 61197626 |
| Family type | — |
| Earliest priority | Sep 7, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10407767B2 — Method for depositing a layer using a magnetron sputtering device |
Representative publication
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US10407767B2 — Method for depositing a layer using a magnetron sputtering device (published Sep 10, 2019)
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