Composite bond structure in stacked semiconductor structure
US-10062656-B2 · Aug 28, 2018 · US
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Patent family 61160421
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 61160421 |
| Family type | — |
| Earliest priority | Aug 15, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10062656B2 — Composite bond structure in stacked semiconductor structure |
Representative publication
Best representative member for this family based on priority and filing country.
US10062656B2 — Composite bond structure in stacked semiconductor structure (published Aug 28, 2018)
Member publications
Related publications in this family.
Composite bond structure in stacked semiconductor structure
US-2018047682-A1 · Feb 15, 2018 · US