Method for etching copper layer
US-10825688-B2 · Nov 3, 2020 · US
This page is not indexed by search engines while we improve data quality.
Patent family 60687193
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 60687193 |
| Family type | — |
| Earliest priority | Jun 10, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10825688B2 — Method for etching copper layer |
Representative publication
Best representative member for this family based on priority and filing country.
US10825688B2 — Method for etching copper layer (published Nov 3, 2020)
Member publications
Related publications in this family.
Method for etching copper layer
US-2019272997-A1 · Sep 5, 2019 · US