Systems and methods for replaceable bail grid array (BGA) packages on board substrates
US-10531575-B2 · Jan 7, 2020 · US
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 59966331 |
| Family type | — |
| Earliest priority | Apr 1, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10531575B2 — Systems and methods for replaceable bail grid array (BGA) packages on board substrates |
Best representative member for this family based on priority and filing country.
US10531575B2 — Systems and methods for replaceable bail grid array (BGA) packages on board substrates (published Jan 7, 2020)
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