Power semiconductor module with heat dissipation plate
US-10818573-B2 · Oct 27, 2020 · US
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Patent family 58100718
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 58100718 |
| Family type | — |
| Earliest priority | Aug 26, 2015 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10818573B2 — Power semiconductor module with heat dissipation plate |
Representative publication
Best representative member for this family based on priority and filing country.
US10818573B2 — Power semiconductor module with heat dissipation plate (published Oct 27, 2020)
Member publications
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Structure
US-2018254235-A1 · Sep 6, 2018 · US