Heat dissipation structure of semiconductor device
US-9997430-B2 · Jun 12, 2018 · US
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Patent family 57838279
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 57838279 |
| Family type | — |
| Earliest priority | Apr 15, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9997430B2 — Heat dissipation structure of semiconductor device |
Representative publication
Best representative member for this family based on priority and filing country.
US9997430B2 — Heat dissipation structure of semiconductor device (published Jun 12, 2018)
Member publications
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Heat dissipation structure of semiconductor device
US-2017301602-A1 · Oct 19, 2017 · US