Method for cleaning via of interconnect structure of semiconductor device structure
US-9761488-B2 · Sep 12, 2017 · US
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Patent family 57776374
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 57776374 |
| Family type | — |
| Earliest priority | Jul 17, 2015 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9761488B2 — Method for cleaning via of interconnect structure of semiconductor device structure |
Representative publication
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US9761488B2 — Method for cleaning via of interconnect structure of semiconductor device structure (published Sep 12, 2017)
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