Via structure and circuit board having the via structure
US-10109569-B2 · Oct 23, 2018 · US
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Patent family 57776344
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 57776344 |
| Family type | — |
| Earliest priority | Jul 16, 2015 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10109569B2 — Via structure and circuit board having the via structure |
Representative publication
Best representative member for this family based on priority and filing country.
US10109569B2 — Via structure and circuit board having the via structure (published Oct 23, 2018)
Member publications
Related publications in this family.
Via structure and circuit board having the via structure
US-2017018490-A1 · Jan 19, 2017 · US