Cu alloy core bonding wire with Pd coating for semiconductor device
US-10672733-B2 · Jun 2, 2020 · US
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Patent family 57394006
This patent family groups 6 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 57394006 |
| Family type | — |
| Earliest priority | May 26, 2015 |
| First filing country | US |
| Member publications | 6 |
| Countries | US |
| Representative publication | US10672733B2 — Cu alloy core bonding wire with Pd coating for semiconductor device |
Representative publication
Best representative member for this family based on priority and filing country.
US10672733B2 — Cu alloy core bonding wire with Pd coating for semiconductor device (published Jun 2, 2020)
Member publications
Related publications in this family.
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
US-2020013747-A1 · Jan 9, 2020 · US
Cu alloy core bonding wire with Pd coating for semiconductor device
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Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
US-2019164927-A1 · May 30, 2019 · US
Cu alloy core bonding wire with Pd coating for semiconductor device
US-10236272-B2 · Mar 19, 2019 · US
Bonding wire for semiconductor device
US-2017117244-A1 · Apr 27, 2017 · US