Solder metallization stack and methods of formation thereof
US-10573611-B2 · Feb 25, 2020 · US
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Patent family 57281488
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 57281488 |
| Family type | — |
| Earliest priority | May 29, 2015 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US10573611B2 — Solder metallization stack and methods of formation thereof |
Representative publication
Best representative member for this family based on priority and filing country.
US10573611B2 — Solder metallization stack and methods of formation thereof (published Feb 25, 2020)
Member publications
Related publications in this family.
Solder Metallization Stack and Methods of Formation Thereof
US-2019051624-A1 · Feb 14, 2019 · US
Solder metallization stack and methods of formation thereof
US-10115688-B2 · Oct 30, 2018 · US
Solder Metallization Stack and Methods of Formation Thereof
US-2016351516-A1 · Dec 1, 2016 · US