Integrated Power Assembly with Reduced Form Factor and Enhanced Thermal Dissipation
US-2016172279-A1 · Jun 16, 2016 · US
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Patent family 56082621
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 56082621 |
| Family type | — |
| Earliest priority | Dec 10, 2014 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2016172279A1 — Integrated Power Assembly with Reduced Form Factor and Enhanced Thermal Dissipation |
Representative publication
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US2016172279A1 — Integrated Power Assembly with Reduced Form Factor and Enhanced Thermal Dissipation (published Jun 16, 2016)
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