Lead-free solder bump joining structure
US-2017259366-A1 · Sep 14, 2017 · US
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Patent family 56074123
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 56074123 |
| Family type | — |
| Earliest priority | Nov 27, 2014 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2017259366A1 — Lead-free solder bump joining structure |
Representative publication
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US2017259366A1 — Lead-free solder bump joining structure (published Sep 14, 2017)
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