This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 55793132 |
| Family type | — |
| Earliest priority | Oct 22, 2014 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US10464291B2 — Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board |
Best representative member for this family based on priority and filing country.
US10464291B2 — Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board (published Nov 5, 2019)
Related publications in this family.
US-10464291-B2 · Nov 5, 2019 · US
US-2017291397-A1 · Oct 12, 2017 · US
US-9724896-B2 · Aug 8, 2017 · US
US-2016120017-A1 · Apr 28, 2016 · US