Polyimides as laser release materials for 3-D IC applications
US-9827740-B2 · Nov 28, 2017 · US
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Patent family 55163956
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 55163956 |
| Family type | — |
| Earliest priority | Jul 22, 2014 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9827740B2 — Polyimides as laser release materials for 3-D IC applications |
Representative publication
Best representative member for this family based on priority and filing country.
US9827740B2 — Polyimides as laser release materials for 3-D IC applications (published Nov 28, 2017)
Member publications
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Polyimides as laser release materials for 3-d ic applications
US-2016023436-A1 · Jan 28, 2016 · US