Multi-via interconnect structure and method of manufacture
US-9425150-B2 · Aug 23, 2016 · US
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Patent family 53775585
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 53775585 |
| Family type | — |
| Earliest priority | Feb 13, 2014 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9425150B2 — Multi-via interconnect structure and method of manufacture |
Representative publication
Best representative member for this family based on priority and filing country.
US9425150B2 — Multi-via interconnect structure and method of manufacture (published Aug 23, 2016)
Member publications
Related publications in this family.
Multi-via interconnect structure and method of manufacture
US-2015228584-A1 · Aug 13, 2015 · US