Bonding wire for semiconductor devices
US-9812421-B2 · Nov 7, 2017 · US
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Patent family 53402655
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 53402655 |
| Family type | — |
| Earliest priority | Dec 17, 2013 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9812421B2 — Bonding wire for semiconductor devices |
Representative publication
Best representative member for this family based on priority and filing country.
US9812421B2 — Bonding wire for semiconductor devices (published Nov 7, 2017)
Member publications
Related publications in this family.
Bonding wire for semiconductor devices
US-2016315063-A1 · Oct 27, 2016 · US