Array based fabrication of power semiconductor package with integrated heat spreader
US-9620475-B2 · Apr 11, 2017 · US
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Patent family 53271953
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 53271953 |
| Family type | — |
| Earliest priority | Dec 9, 2013 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9620475B2 — Array based fabrication of power semiconductor package with integrated heat spreader |
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US9620475B2 — Array based fabrication of power semiconductor package with integrated heat spreader (published Apr 11, 2017)
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