Power semiconductor package with integrated heat spreader and partially etched conductive carrier
US-9570379-B2 · Feb 14, 2017 · US
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Patent family 53271925
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 53271925 |
| Family type | — |
| Earliest priority | Dec 9, 2013 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9570379B2 — Power semiconductor package with integrated heat spreader and partially etched conductive carrier |
Representative publication
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US9570379B2 — Power semiconductor package with integrated heat spreader and partially etched conductive carrier (published Feb 14, 2017)
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