Method for singulating packaged integrated circuits and resulting structures
US-9875913-B2 · Jan 23, 2018 · US
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 52995886 |
| Family type | — |
| Earliest priority | Oct 30, 2013 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9875913B2 — Method for singulating packaged integrated circuits and resulting structures |
Best representative member for this family based on priority and filing country.
US9875913B2 — Method for singulating packaged integrated circuits and resulting structures (published Jan 23, 2018)
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