Multichip integration with through silicon via (TSV) die embedded in package
US-9716084-B2 · Jul 25, 2017 · US
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Patent family 51864230
This patent family groups 5 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 51864230 |
| Family type | — |
| Earliest priority | May 13, 2013 |
| First filing country | US |
| Member publications | 5 |
| Countries | US |
| Representative publication | US9716084B2 — Multichip integration with through silicon via (TSV) die embedded in package |
Representative publication
Best representative member for this family based on priority and filing country.
US9716084B2 — Multichip integration with through silicon via (TSV) die embedded in package (published Jul 25, 2017)
Member publications
Related publications in this family.
Multichip integration with through silicon via (tsv) die embedded in package
US-2016322344-A1 · Nov 3, 2016 · US
Multichip integration with through silicon via (TSV) die embedded in package
US-9397079-B2 · Jul 19, 2016 · US
Multichip integration with through silicon via (tsv) die embedded in package
US-2015171067-A1 · Jun 18, 2015 · US
Multichip integration with through silicon via (TSV) die embedded in package
US-9000599-B2 · Apr 7, 2015 · US