Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate
US-9723707-B2 · Aug 1, 2017 · US
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Patent family 49260386
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 49260386 |
| Family type | — |
| Earliest priority | Mar 30, 2012 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9723707B2 — Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate |
Representative publication
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US9723707B2 — Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate (published Aug 1, 2017)
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