Power module substrate with heatsink, power module substrate with cooler and power module
US-2015055302-A1 · Feb 26, 2015 · US
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 49260366 |
| Family type | — |
| Earliest priority | Mar 30, 2012 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2015055302A1 — Power module substrate with heatsink, power module substrate with cooler and power module |
Best representative member for this family based on priority and filing country.
US2015055302A1 — Power module substrate with heatsink, power module substrate with cooler and power module (published Feb 26, 2015)
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