Electroless surface treatment plated layers of printed circuit board and method for preparing the same
US-9743508-B2 · Aug 22, 2017 · US
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Patent family 47390496
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 47390496 |
| Family type | — |
| Earliest priority | Jun 28, 2011 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US9743508B2 — Electroless surface treatment plated layers of printed circuit board and method for preparing the same |
Representative publication
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US9743508B2 — Electroless surface treatment plated layers of printed circuit board and method for preparing the same (published Aug 22, 2017)
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