Electroplating apparatus and process for wafer level packaging
US-10309024-B2 · Jun 4, 2019 · US
This page is not indexed by search engines while we improve data quality.
Patent family 46161198
This patent family groups 5 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 46161198 |
| Family type | — |
| Earliest priority | Dec 1, 2010 |
| First filing country | US |
| Member publications | 5 |
| Countries | US |
| Representative publication | US10309024B2 — Electroplating apparatus and process for wafer level packaging |
Representative publication
Best representative member for this family based on priority and filing country.
US10309024B2 — Electroplating apparatus and process for wafer level packaging (published Jun 4, 2019)
Member publications
Related publications in this family.
Electroplating apparatus and process for wafer level packaging
US-2018237933-A1 · Aug 23, 2018 · US
Electroplating apparatus and process for wafer level packaging
US-9982357-B2 · May 29, 2018 · US
Electroplating apparatus and process for wafer level packaging
US-2016312373-A1 · Oct 27, 2016 · US
Electroplating apparatus and process for wafer level packaging
US-9404194-B2 · Aug 2, 2016 · US