Methods of forming strained-semiconductor-on-insulator device structures
US-10510581-B2 · Dec 17, 2019 · US
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 29716052 |
| Family type | — |
| Earliest priority | Jun 7, 2002 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US10510581B2 — Methods of forming strained-semiconductor-on-insulator device structures |
Best representative member for this family based on priority and filing country.
US10510581B2 — Methods of forming strained-semiconductor-on-insulator device structures (published Dec 17, 2019)
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US-10510581-B2 · Dec 17, 2019 · US
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