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between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink

between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
Metric	Value
CPC code	H10W90/757
Official title	{between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink}
Display label	between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink
Total patents	6

Year-over-year patent counts classified under this CPC code.

Filing activity appears to be declining based on the most recent years.

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.