Sequential infiltration synthesis for advanced lithography
US-9786511-B2 · Oct 10, 2017 · US
Electron beam lithography processes
Electron beam lithography processes · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P76/2045 |
| Official title | {Electron beam lithography processes} |
| Display label | Electron beam lithography processes |
| Total patents | 185 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 21 |
| 2016 | 18 |
| 2017 | 27 |
| 2018 | 18 |
| 2019 | 31 |
| 2020 | 19 |
| 2021 | 15 |
| 2022 | 9 |
| 2023 | 13 |
| 2024 | 9 |
| 2025 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Cross scan proximity correction with ebeam universal cutter
US-2017269481-A1 · Sep 21, 2017 · US
Lithography Patterning with a Gas Phase Resist
US-2017256418-A1 · Sep 7, 2017 · US
Multi-pass patterning using nonreflecting radiation lithography on an underlying grating
US-2017235228-A1 · Aug 17, 2017 · US
Method to define multiple layer patterns with a single exposure by charged particle beam lithography
US-9726983-B2 · Aug 8, 2017 · US
Continuous Writing of Pattern
US-2017200584-A1 · Jul 13, 2017 · US
High-sensitivity multilayer resist film and method of increasing photosensitivity of resist film
US-9703197-B2 · Jul 11, 2017 · US
Method of fabricating an integrated circuit with a pattern density-outlier-treatment for optimized pattern density uniformity
US-2017186584-A1 · Jun 29, 2017 · US
Photomask for forming multiple layer patterns with a single exposure
US-9685367-B2 · Jun 20, 2017 · US
Electronic device having carbon layer and method for manufacturing the same
US-9666673-B2 · May 30, 2017 · US
Photomask for forming multiple layer patterns with a single exposure
US-2017110366-A1 · Apr 20, 2017 · US
Direct nanolithography or printing method for electron beams in wet environment
US-2017075234-A1 · Mar 16, 2017 · US
Ebeam align on the fly
US-2017076967-A1 · Mar 16, 2017 · US
Unidirectional metal on layer with ebeam
US-2017077029-A1 · Mar 16, 2017 · US
Chemical sensors based on plasmon resonance in graphene
US-9594018-B2 · Mar 14, 2017 · US
Data compression for ebeam throughput
US-2017069509-A1 · Mar 9, 2017 · US
Ebeam non-universal cutter
US-2017069461-A1 · Mar 9, 2017 · US
Method To Define Multiple Layer Patterns With A Single Exposure By Charged Particle Beam Lithography
US-2017045827-A1 · Feb 16, 2017 · US
Method of fabricating an integrated circuit with a pattern density-outlier-treatment for optimized pattern density uniformity
US-9552964-B2 · Jan 24, 2017 · US
Techniques for forming a compacted array of functional cells
US-2017018543-A1 · Jan 19, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P76/2045?
- CPC H10P76/2045 is the Cooperative Patent Classification code for “Electron beam lithography processes.”
- How many patents are filed under CPC H10P76/2045 (Electron beam lithography processes)?
- Our database includes 185 publications tagged with this CPC code.
- Is patent activity under CPC H10P76/2045 growing?
- Publication counts under this code: 9 in 2024 vs 5 in 2025 (latest complete years).