characterised by provisions for the orientation or alignment of the layer to be deposited

characterised by provisions for the orientation or alignment of the layer to be deposited · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH10K71/191
Official title{characterised by provisions for the orientation or alignment of the layer to be deposited}
Display labelcharacterised by provisions for the orientation or alignment of the layer to be deposited
Total patents771

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is declining.

Patents filed per year
YearPatents
201553
201673
201780
201876
2019114
202086
202180
202269
202351
202446
202535
20268

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H10K71/191?
CPC H10K71/191 is the Cooperative Patent Classification code for “characterised by provisions for the orientation or alignment of the layer to be deposited.”
How many patents are filed under CPC H10K71/191 (characterised by provisions for the orientation or alignment of the layer to be deposited)?
Our database includes 771 publications tagged with this CPC code.
Is patent activity under CPC H10K71/191 growing?
Publication counts under this code: 46 in 2024 vs 35 in 2025 (latest complete years).