Electronic device and method for manufacturing electronic device
US-12588351-B2 · Mar 24, 2026 · US
Integrated devices having a three-dimensional layout, e.g. 3D ICs · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10K39/401 |
| Official title | {Integrated devices having a three-dimensional layout, e.g. 3D ICs} |
| Display label | Integrated devices having a three-dimensional layout, e.g. 3D ICs |
| Total patents | 13 |
Year-over-year patent counts classified under this CPC code.
Filing activity appears stable based on the most recent years.
| Year | Patents |
|---|---|
| 2022 | 1 |
| 2023 | 5 |
| 2024 | 3 |
| 2025 | 3 |
| 2026 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-12588351-B2 · Mar 24, 2026 · US
US-12457842-B2 · Oct 28, 2025 · US
US-12426435-B2 · Sep 23, 2025 · US
US-2025126960-A1 · Apr 17, 2025 · US
US-12094892-B2 · Sep 17, 2024 · US
US-2024074220-A1 · Feb 29, 2024 · US
US-2024032316-A1 · Jan 25, 2024 · US
US-2023345747-A1 · Oct 26, 2023 · US
US-2023197741-A1 · Jun 22, 2023 · US
US-2023144505-A1 · May 11, 2023 · US
US-2023030824-A1 · Feb 2, 2023 · US
US-11557632-B2 · Jan 17, 2023 · US
US-2022085108-A1 · Mar 17, 2022 · US