Conductive slip ring
US-11316314-B2 · Apr 26, 2022 · US
by means of moulded or cast material applied during or after assembly · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01R39/16 |
| Official title | by means of moulded or cast material applied during or after assembly |
| Display label | by means of moulded or cast material applied during or after assembly |
| Total patents | 14 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 1 |
| 2017 | 3 |
| 2018 | 2 |
| 2019 | 2 |
| 2020 | 1 |
| 2021 | 1 |
| 2022 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-11316314-B2 · Apr 26, 2022 · US
US-10916878-B2 · Feb 9, 2021 · US
US-2020335925-A1 · Oct 22, 2020 · US
US-2019393654-A1 · Dec 26, 2019 · US
US-10256704-B2 · Apr 9, 2019 · US
US-10110099-B2 · Oct 23, 2018 · US
US-2018233994-A1 · Aug 16, 2018 · US
US-9705272-B2 · Jul 11, 2017 · US
US-2017141657-A1 · May 18, 2017 · US
US-9641052-B2 · May 2, 2017 · US
US-9343945-B2 · May 17, 2016 · US
US-2015333605-A1 · Nov 19, 2015 · US
US-2015280533-A1 · Oct 1, 2015 · US
US-2015180187-A1 · Jun 25, 2015 · US