This page is not indexed by search engines while we improve data quality.

by means of moulded or cast material applied during or after assembly

by means of moulded or cast material applied during or after assembly · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01R39/16
Official titleby means of moulded or cast material applied during or after assembly
Display labelby means of moulded or cast material applied during or after assembly
Total patents14

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is declining.

Patents filed per year
YearPatents
20153
20161
20173
20182
20192
20201
20211
20221

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.