Unitary molded USB device

Patent metadata

Field	Value
Publication number	US-10916878-B2
Application number	US-201816016233-A
Country	US
Kind code	B2
Filing date	Jun 22, 2018
Priority date	Jun 22, 2018
Publication date	Feb 9, 2021
Grant date	Feb 9, 2021

Abstract

A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.

First claim

We claim:

1. A USB device, including:
a semiconductor device;
a housing flowed around a top and bottom of the semiconductor device to affix the semiconductor device within the USB device and to enclose the semiconductor device within the USB device, the housing comprising a space above the semiconductor device configured to allow insertion of the USB device into a USB device host slot.

2. A USB device as recited in claim 1 , wherein the housing includes a lip and a back wall for restraining the semiconductor device in a first direction.

3. A USB device as recited in claim 2 , wherein the housing includes a base and support surface for restraining the semiconductor device in a second direction orthogonal to the first direction.

4. A USB device as recited in claim 2 , wherein the back wall is further configured to be gripped for inserting the USB device into the USB device host slot and for removing the USB device from the USB device host slot.

5. A USB device as recited in claim 1 , wherein the semiconductor device includes a notch, and wherein the housing is engaged within the notch for restraining the semiconductor device within the housing.

6. A USB device as recited in claim 1 , wherein the housing is formed of plastic.

7. A USB device as recited in claim 1 , wherein the housing is formed of a polycarbonate-acrylonitrile butadiene styrene polymer blend.

8. A USB device as recited in claim 1 , further comprising an electrical conductor applied to an outer surface of the housing.

9. A USB device, including:
a semiconductor device comprising a plurality of connector pins;
a housing injection molded around the semiconductor device, the housing engaging the semiconductor device at a plurality of points comprising lip and a back wall such that the semiconductor device is fixed within the housing, the housing comprising a space above the plurality of connector pins, the space configured to allow insertion of the USB device into a USB device host slot;
wherein the back wall is further configured to be gripped for inserting the USB device into the USB device host slot and for removing the USB device from the USB device host slot.

10. A USB device as recited in claim 9 , wherein the plurality of points include a base and support surface for engaging the semiconductor device and restraining the semiconductor device in a second direction orthogonal to the first direction.

11. A USB device as recited in claim 9 , wherein the semiconductor device includes a notch, and wherein the plurality of points comprise portions of the housing filling the notch to restrain the semiconductor device within the housing.

12. A USB device as recited in claim 9 , wherein the semiconductor device comprises a system in a package.

13. A USB device as recited in claim 9 , wherein the semiconductor device comprises a plurality of memory die.

14. A method of fabricating USB devices, comprising:
(a) placing a plurality of semiconductor devices in a mold;
(b) encasing a top and bottom of the plurality of semiconductor devices in a molten molding compound, the molten molding compound injected around the top and bottom of the plurality of semiconductor devices with a space above each of the plurality of semiconductor devices;
(c) curing the molten molding compound around the plurality of semiconductor devices; and
(d) separating the encased plurality of semiconductor devices into individual USB devices.

15. The method of claim 14 , further comprising the step of applying an electrical conductor to an outer surface of the molding compound for electrically grounding the USB devices.

16. The method of claim 14 , wherein said step (b) of encasing the plurality of semiconductor devices in a molding compound comprises the step of injecting the molding compound into the mold, around the plurality of semiconductor devices.

17. The method of claim 14 , wherein said step (b) of encasing the plurality of semiconductor devices in a molding compound comprises the step of engaging the semiconductor device at a plurality of points such that the semiconductor device is fixed within the housing.

18. A USB device, including:
a semiconductor device means for storing data;
housing means for flowing around a top and bottom of the semiconductor device to affix and encase the semiconductor device within the housing means, the housing means comprising a space above the semiconductor device configured to allow insertion of the USB device into a USB device host slot.

Assignees

• Western Digital Tech Inc

Inventors

• Guan Tee Khoon
• Rai Pradeep Kumar

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/016

  using moulds · CPC title

• H10W74/01

  Manufacture or treatment · CPC title

• H10W72/0198

  batch processes · CPC title