Electronic substrates having embedded inductors
US-2024331921-A1 · Oct 3, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/645 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,239 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 71 |
| 2016 | 68 |
| 2017 | 102 |
| 2018 | 108 |
| 2019 | 135 |
| 2020 | 152 |
| 2021 | 128 |
| 2022 | 140 |
| 2023 | 102 |
| 2024 | 108 |
| 2025 | 102 |
| 2026 | 23 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Filtering structure and electronic device
US-2024047385-A1 · Feb 8, 2024 · US
Rolled-up inductor structure for a radiofrequency integrated circuit (RFIC)
US-9224532-B2 · Dec 29, 2015 · US
Semiconductor device
US-9224670-B2 · Dec 29, 2015 · US
Electromagnetic resonance coupler
US-9224534-B2 · Dec 29, 2015 · US
Die-to-die inductive communication devices and methods
US-9219028-B1 · Dec 22, 2015 · US
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
US-2015364816-A1 · Dec 17, 2015 · US
Integrated circuit with guard ring
US-2015364417-A1 · Dec 17, 2015 · US
Hybrid carbon-metal interconnect structures
US-9209136-B2 · Dec 8, 2015 · US
Semiconductor package
US-9209148-B2 · Dec 8, 2015 · US
Reconfigurable multi-stack inductor
US-2015348919-A1 · Dec 3, 2015 · US
Through substrate features in semiconductor substrates
US-9196670-B2 · Nov 24, 2015 · US
Non-cylindrical conducting shapes in multilayer laminated substrate cores
US-9198293-B2 · Nov 24, 2015 · US
Semiconductor device and method of forming RF FEM and RF transceiver in semiconductor package
US-9190340-B2 · Nov 17, 2015 · US
Low-impedance power delivery for a packaged die
US-9190396-B2 · Nov 17, 2015 · US
Semiconductor device
US-2015318245-A1 · Nov 5, 2015 · US
Apparatus related to an improved package including a semiconductor die
US-9177925-B2 · Nov 3, 2015 · US
Systems and methods for integrating bootstrap circuit elements in power transistors and other devices
US-9171738-B2 · Oct 27, 2015 · US
Semiconductor device including coupling conductive pattern
US-9165893-B2 · Oct 20, 2015 · US
Integrated electronic device with transceiving antenna and magnetic interconnection
US-2015294946-A1 · Oct 15, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/645?
- CPC H01L23/645 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/645 (Electricity)?
- Our database includes 1,239 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/645 growing?
- Publication counts under this code: 108 in 2024 vs 102 in 2025 (latest complete years).