Hybrid carbon-metal interconnect structures

Patent metadata

Field	Value
Publication number	US-9209136-B2
Application number	US-201313854449-A
Country	US
Kind code	B2
Filing date	Apr 1, 2013
Priority date	Apr 1, 2013
Publication date	Dec 8, 2015
Grant date	Dec 8, 2015

Abstract

Embodiments of the present disclosure are directed towards techniques and configurations for hybrid carbon-metal interconnect structures in integrated circuit assemblies. In one embodiment, an apparatus includes a substrate, a metal interconnect layer disposed on the substrate and configured to serve as a growth initiation layer for a graphene layer and the graphene layer, wherein the graphene layer is formed directly on the metal interconnect layer, the metal interconnect layer and the graphene layer being configured to route electrical signals. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. An apparatus comprising: a substrate; a metal interconnect layer disposed on and in direct contact with the substrate and to serve as a growth initiation layer for a graphene layer; and the graphene layer, wherein the graphene layer is formed directly on the metal interconnect layer, the metal interconnect layer and the graphene layer to route electrical signals;
a first dielectric layer disposed on the graphene layer, the first dielectric layer in direct co…

Assignees

• Intel Corp

Inventors

• Barth Hans-Joachim

Classifications

• H10W20/0633

  Electricity · mapped topic

• H10W72/552

  Electricity · mapped topic

• H10W90/754

  Electricity · mapped topic

• H10W90/724

  Electricity · mapped topic

• H10W90/722

  Electricity · mapped topic