Chip package
US-9425134-B2 · Aug 23, 2016 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/525 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 557 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 55 |
| 2016 | 79 |
| 2017 | 81 |
| 2018 | 61 |
| 2019 | 95 |
| 2020 | 72 |
| 2021 | 33 |
| 2022 | 21 |
| 2023 | 23 |
| 2024 | 19 |
| 2025 | 16 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Chip package and method for fabricating the same
US-9391021-B2 · Jul 12, 2016 · US
Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package
US-9305854-B2 · Apr 5, 2016 · US
Ball amount process in the manufacturing of integrated circuit
US-9269658-B2 · Feb 23, 2016 · US
Electronic substrate, semiconductor device, and electronic device
US-9251942-B2 · Feb 2, 2016 · US
Semiconductor module having deflecting conductive layer over a spacer structure
US-9219034-B2 · Dec 22, 2015 · US
Method and system for split threshold voltage programmable bitcells
US-9214466-B2 · Dec 15, 2015 · US
Chip package
US-9209124-B2 · Dec 8, 2015 · US
Semiconductor package
US-9209148-B2 · Dec 8, 2015 · US
Fan out package structure and methods of forming
US-9209045-B2 · Dec 8, 2015 · US
Semiconductor device and method of manufacturing the same
US-9202767-B2 · Dec 1, 2015 · US
ESD protection device
US-9202791-B2 · Dec 1, 2015 · US
Contact pad for semiconductor devices
US-9196529-B2 · Nov 24, 2015 · US
Chip package and fabrication method thereof
US-9196754-B2 · Nov 24, 2015 · US
Directly sawing wafers covered with liquid molding compound
US-9196559-B2 · Nov 24, 2015 · US
Chip package and method for forming the same
US-9196594-B2 · Nov 24, 2015 · US
Etchant and method for manufacturing semiconductor device using same
US-9177827-B2 · Nov 3, 2015 · US
Semiconductor component with a front side and a back side metallization layer and manufacturing method thereof
US-9177893-B2 · Nov 3, 2015 · US
Semiconductor device having a fuse element
US-9177912-B2 · Nov 3, 2015 · US
Methods and apparatus for transmission lines in packages
US-9171798-B2 · Oct 27, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/525?
- CPC H01L23/525 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/525 (Electricity)?
- Our database includes 557 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/525 growing?
- Publication counts under this code: 19 in 2024 vs 16 in 2025 (latest complete years).