Shielded metal-oxide-metal (MOM) capacitor structure
US-9224685-B1 · Dec 29, 2015 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/522 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,101 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 87 |
| 2016 | 115 |
| 2017 | 102 |
| 2018 | 108 |
| 2019 | 155 |
| 2020 | 173 |
| 2021 | 120 |
| 2022 | 82 |
| 2023 | 58 |
| 2024 | 53 |
| 2025 | 46 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device having groove-shaped via-hole
US-9224689-B2 · Dec 29, 2015 · US
Semiconductor device having groove-shaped via-hole
US-9224690-B2 · Dec 29, 2015 · US
Power Semiconductor Device, Manufacturing Method Therefor, and Method for Operating the Power Semiconductor Device
US-2015364524-A1 · Dec 17, 2015 · US
Selecting circuits of a multi-level integrated circuit
US-2015364466-A1 · Dec 17, 2015 · US
Manufacturing method of a semiconductor device and method for creating a layout thereof
US-9209070-B2 · Dec 8, 2015 · US
Package board and method for manufacturing the same
US-2015351228-A1 · Dec 3, 2015 · US
Pad over interconnect pad structure design
US-9189585-B2 · Nov 17, 2015 · US
High performance deposited die attach
US-9177907-B1 · Nov 3, 2015 · US
Integrated circuit devices including interconnections insulated by air gaps and methods of fabricating the same
US-9165820-B2 · Oct 20, 2015 · US
Copper interconnect structures and methods of making same
US-9159653-B2 · Oct 13, 2015 · US
Semiconductor device and a method of manufacturing the same
US-9159650-B2 · Oct 13, 2015 · US
Semiconductor devices having back side bonding structures
US-9147640-B2 · Sep 29, 2015 · US
Methods of making integrated circuits including air gaps around interconnect structures
US-9147602-B2 · Sep 29, 2015 · US
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
US-9142510-B2 · Sep 22, 2015 · US
Device isolation using preferential oxidation of the bulk substrate
US-2015263102-A1 · Sep 17, 2015 · US
Perforated electronic package and method of fabrication
US-2015262941-A1 · Sep 17, 2015 · US
Conductive line patterning
US-9136168-B2 · Sep 15, 2015 · US
Semiconductor device and method of manufacturing the same
US-9136216-B2 · Sep 15, 2015 · US
Clock skew adjusting method and structure
US-9135389-B2 · Sep 15, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/522?
- CPC H01L23/522 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/522 (Electricity)?
- Our database includes 1,101 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/522 growing?
- Publication counts under this code: 53 in 2024 vs 46 in 2025 (latest complete years).