Method for fabricating a semiconductor device including an embedded semiconductor die
US-2024250004-A1 · Jul 25, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/485 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,669 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 85 |
| 2016 | 105 |
| 2017 | 153 |
| 2018 | 202 |
| 2019 | 263 |
| 2020 | 237 |
| 2021 | 172 |
| 2022 | 127 |
| 2023 | 125 |
| 2024 | 107 |
| 2025 | 80 |
| 2026 | 13 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Formation of a high aspect ratio contact hole
US-9224803-B2 · Dec 29, 2015 · US
Semiconductor device having groove-shaped via-hole
US-9224689-B2 · Dec 29, 2015 · US
Semiconductor device having groove-shaped via-hole
US-9224690-B2 · Dec 29, 2015 · US
Sidewall free CESL for enlarging ILD gap-fill window
US-9218974-B2 · Dec 22, 2015 · US
Integrated circuit devices including a through-silicon via structure and methods of fabricating the same
US-9214411-B2 · Dec 15, 2015 · US
Semiconductor device and method of making
US-9209268-B2 · Dec 8, 2015 · US
Contact bars with reduced fringing capacitance in a semiconductor device
US-9184095-B2 · Nov 10, 2015 · US
Stacked redistribution layers on die
US-9171782-B2 · Oct 27, 2015 · US
Copper interconnect structures and methods of making same
US-9159653-B2 · Oct 13, 2015 · US
Semiconductor structures having adhesion promoting layer in cavities
US-9159662-B2 · Oct 13, 2015 · US
Use of dielectric slots for reducing via resistance in dual damascene process
US-2015287631-A1 · Oct 8, 2015 · US
Method of preventing a pattern collapse
US-9153479-B2 · Oct 6, 2015 · US
Interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
US-9147587-B2 · Sep 29, 2015 · US
Semiconductor structure and method making the same
US-2015270156-A1 · Sep 24, 2015 · US
Manganese oxide hard mask for etching dielectric materials
US-9142488-B2 · Sep 22, 2015 · US
Copper contact plugs with barrier layers
US-9136206-B2 · Sep 15, 2015 · US
Formation of liner and barrier for tungsten as gate electrode and as contact plug to reduce resistance and enhance device performance
US-9129945-B2 · Sep 8, 2015 · US
Electroless filled conductive structures
US-9123706-B2 · Sep 1, 2015 · US
Contact techniques and configurations for reducing parasitic resistance in nanowire transistors
US-9123790-B2 · Sep 1, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/485?
- CPC H01L23/485 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/485 (Electricity)?
- Our database includes 1,669 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/485 growing?
- Publication counts under this code: 107 in 2024 vs 80 in 2025 (latest complete years).