What is CPC H01L23/48?

CPC H01L23/48 is the Cooperative Patent Classification code for “Electricity.”

How many patents are filed under CPC H01L23/48 (Electricity)?

Our database includes 955 publications tagged with this CPC code.

Is patent activity under CPC H01L23/48 growing?

Publication counts under this code: 38 in 2024 vs 25 in 2025 (latest complete years).

Electricity

Electricity · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

Electricity

CPC classification statistics
Metric	Value
CPC code	H01L23/48
Official title	—
Display label	Electricity (mapped technology topic)
Total patents	955

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is rapidly declining.

Patents filed per year
Year	Patents
2015	161
2016	93
2017	79
2018	109
2019	153
2020	121
2021	76
2022	49
2023	40
2024	38
2025	25
2026	11

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Electromagnetic resonance coupler
US-9224534-B2 · Dec 29, 2015 · US
Semiconductor device
US-9214409-B2 · Dec 15, 2015 · US
Manufacturing method of a semiconductor device and method for creating a layout thereof
US-9209070-B2 · Dec 8, 2015 · US
Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
US-9209166-B2 · Dec 8, 2015 · US
IGBT with emitter electrode electrically connected with an impurity zone
US-9209109-B2 · Dec 8, 2015 · US
Integrated circuit protection and ruggedization coatings and methods
US-9196555-B1 · Nov 24, 2015 · US
Electronic component, arrangement and method
US-9196554-B2 · Nov 24, 2015 · US
Semiconductor devices and methods of manufacture thereof
US-9190345-B1 · Nov 17, 2015 · US
Latch-up suppression and substrate noise coupling reduction through a substrate back-tie for 3D integrated circuits
US-9184110-B2 · Nov 10, 2015 · US
Latch-up suppression and substrate noise coupling reduction through a substrate back-tie for 3D integrated circuits
US-9177894-B2 · Nov 3, 2015 · US
Substrate with bump structure and manufacturing method thereof
US-9177830-B1 · Nov 3, 2015 · US
Methods of forming electrically conductive lines
US-9171750-B2 · Oct 27, 2015 · US
Bump pad structure
US-9171811-B2 · Oct 27, 2015 · US
Fluorine-containing conductive films
US-2015303101-A1 · Oct 22, 2015 · US
Semiconductor device with air gap and method for fabricating the same
US-9165859-B2 · Oct 20, 2015 · US
Molded semiconductor package with pluggable lead
US-9153518-B2 · Oct 6, 2015 · US
Semiconductor dies having opposing sides with different reflectivity
US-9147639-B2 · Sep 29, 2015 · US
Power module semiconductor device
US-9147622-B2 · Sep 29, 2015 · US
Method for verifying the alignment between integrated electronic devices
US-9147636-B2 · Sep 29, 2015 · US
Wireless module with plural in-plane terminals
US-9129941-B2 · Sep 8, 2015 · US

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01L23/48?: CPC H01L23/48 is the Cooperative Patent Classification code for “Electricity.”
How many patents are filed under CPC H01L23/48 (Electricity)?: Our database includes 955 publications tagged with this CPC code.
Is patent activity under CPC H01L23/48 growing?: Publication counts under this code: 38 in 2024 vs 25 in 2025 (latest complete years).