Glass/Ceramic Replacement of Epoxy for High Temperature Hermetically Sealed Non-Axial Electronic Packages
US-2015380333-A1 · Dec 31, 2015 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/291 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,070 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 62 |
| 2016 | 97 |
| 2017 | 86 |
| 2018 | 108 |
| 2019 | 114 |
| 2020 | 121 |
| 2021 | 89 |
| 2022 | 79 |
| 2023 | 84 |
| 2024 | 101 |
| 2025 | 100 |
| 2026 | 29 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device and manufacturing method thereof
US-9224667-B2 · Dec 29, 2015 · US
Semiconductor HEMT device with stoichiometric silicon nitride layer
US-9224668-B2 · Dec 29, 2015 · US
Thin film transistor display panel and manufacturing method thereof
US-9219085-B2 · Dec 22, 2015 · US
3d interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
US-2015364425-A1 · Dec 17, 2015 · US
Method for forming mos device passivation layer and mos device
US-2015364397-A1 · Dec 17, 2015 · US
Compound semiconductor device and manufacturing method therefor
US-9209042-B2 · Dec 8, 2015 · US
Method of Manufacturing a Semiconductor Device with a Continuous Silicate Glass Structure
US-2015348776-A1 · Dec 3, 2015 · US
Direct/laminate hybrid encapsulation and method of hybrid encapsulation
US-2015348803-A1 · Dec 3, 2015 · US
Passivation Structure of Fin Field Effect Transistor
US-2015340302-A1 · Nov 26, 2015 · US
Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device
US-9190365-B2 · Nov 17, 2015 · US
Compound semiconductor device and method of manufacturing the same
US-9184273-B2 · Nov 10, 2015 · US
Enhancement mode iii-nitride device and method for manufacturing thereof
US-2015318374-A1 · Nov 5, 2015 · US
Preventing buried oxide gouging during planar and finfet processing on soi
US-2015318180-A1 · Nov 5, 2015 · US
Semiconductor component having a passivation layer and production method
US-9177829-B2 · Nov 3, 2015 · US
Systems and methods to enhance passivation integrity
US-2015311156-A1 · Oct 29, 2015 · US
Semiconductor device and method for manufacturing semiconductor device
US-2015311165-A1 · Oct 29, 2015 · US
Array Substrate for Display Device and Manufacturing Method Thereof
US-2015303123-A1 · Oct 22, 2015 · US
Metal oxide tft with improved stability and mobility
US-2015303311-A1 · Oct 22, 2015 · US
Methods of passivating surfaces of wide bandgap semiconductor devices
US-9166033-B2 · Oct 20, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/291?
- CPC H01L23/291 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/291 (Electricity)?
- Our database includes 1,070 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/291 growing?
- Publication counts under this code: 101 in 2024 vs 100 in 2025 (latest complete years).