Circuit test structure and method of using
US-2024094282-A1 · Mar 21, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/12 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 726 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 53 |
| 2016 | 51 |
| 2017 | 45 |
| 2018 | 69 |
| 2019 | 103 |
| 2020 | 90 |
| 2021 | 69 |
| 2022 | 86 |
| 2023 | 58 |
| 2024 | 55 |
| 2025 | 39 |
| 2026 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor module for high pressure applications
US-9484275-B2 · Nov 1, 2016 · US
Semiconductor package substrate, package system using the same and method for manufacturing thereof
US-9466543-B2 · Oct 11, 2016 · US
Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof
US-9406531-B1 · Aug 2, 2016 · US
Co-support for XFD packaging
US-9293444-B2 · Mar 22, 2016 · US
Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate
US-9281271-B2 · Mar 8, 2016 · US
Power device cassette with auxiliary emitter contact
US-2016056135-A1 · Feb 25, 2016 · US
Semiconductor power modules and devices
US-9224721-B2 · Dec 29, 2015 · US
Co-support for xfd packaging
US-2015364450-A1 · Dec 17, 2015 · US
Package substrate and flip-chip package circuit including the same
US-2015364408-A1 · Dec 17, 2015 · US
3D Packages and Methods for Forming the Same
US-2015357255-A1 · Dec 10, 2015 · US
Power Semiconductor Package with Multi-Section Conductive Carrier
US-2015348884-A1 · Dec 3, 2015 · US
Integrated circuit packaging system with pattern-through-mold and method of manufacture thereof
US-9202742-B1 · Dec 1, 2015 · US
Methods of fabricating fan-out wafer level packages and packages formed by the methods
US-9202716-B2 · Dec 1, 2015 · US
Semiconductor device
US-2015340325-A1 · Nov 26, 2015 · US
Stacked device identification assignment
US-9196313-B2 · Nov 24, 2015 · US
Semiconductor package including an embedded surface mount device and method of forming the same
US-9196586-B2 · Nov 24, 2015 · US
Semiconductor chip and semiconductor device
US-9190378-B2 · Nov 17, 2015 · US
Semiconductor integrated circuit device, electronic apparatus, and display apparatus
US-9177882-B2 · Nov 3, 2015 · US
Semiconductor device
US-9165879-B2 · Oct 20, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/12?
- CPC H01L23/12 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/12 (Electricity)?
- Our database includes 726 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/12 growing?
- Publication counts under this code: 55 in 2024 vs 39 in 2025 (latest complete years).