Stacked device identification assignment

Patent metadata

Field	Value
Publication number	US-9196313-B2
Application number	US-201414511794-A
Country	US
Kind code	B2
Filing date	Oct 10, 2014
Priority date	Sep 11, 2008
Publication date	Nov 24, 2015
Grant date	Nov 24, 2015

Abstract

Some embodiments include apparatus and methods having dice arranged in a stack. The dice include at least a first die and a second die, and a connection coupled to the dice. The connection may be configured to transfer control information to the first die during an assignment of a first identification to the first die and to transfer the control information from the first die to the second die during an assignment of a second identification to the second die.

First claim

What is claimed is:

1. An apparatus comprising:
a first die including a first via going through the first die, and a second via going through the first die;
a second die arranged in a stack with the first die, the second die including a third via going through the second die, and a fourth via going through the second die, wherein the first via and the fourth via are substantially aligned in a direction perpendicular to the stack, and the second via and the third via are substantially aligned in a direction perpendicular to the stack; and
conductive joints outside the first die and the second die and between the first die and the second die, wherein one of the conductive joints is coupled to the second via and the third via, and none of the conductive joints is coupled to the first via and the fourth via.

2. The apparatus of claim 1 , further comprising:
a third die arranged in the stack with the first die and the second die, the third die including a fifth via going through the third die, and a sixth second via going through the third die, wherein the fifth via and the fourth via are substantially aligned in a direction perpendicular to the stack, and the sixth via and the third via are substantially aligned in a direction perpendicular to the stack; and
additional conductive joints outside the second die and the third die and between the second die and the third die, wherein one of the additional conductive joints is coupled to the fourth via and the fifth via, and none of the additional conductive joints is coupled to the third via and the sixth via.

3. The apparatus of claim 2 , further comprising:
a fourth die arranged in the stack with the first die, the second die, and the third die, the fourth die including a seventh via going through the fourth die, and an eighth via going through the fourth die, wherein the seventh via and the sixth via are substantially aligned in a direction perpendicular to the stack, and the eighth via and the fifth via are substantially aligned in a direction perpendicular to the stack, and wherein the additional conductive joints are first additional conductive joints; and
second additional conductive joints outside the third die and the fourth die and between the third die and the fourth die, wherein one of the second additional conductive joints is coupled to the sixth via and the seventh via, and none of the second additional conductive joints is coupled to the fifth via and the eighth via.

4. The apparatus of claim 1 , wherein the first die further comprising a first contact coupled to the first via, a second contact coupled to the second via, and a first logic component coupled to the first and second contacts.

5. The apparatus of claim 4 , wherein the second die further comprising a third contact coupled to the third via, a fourth contact coupled to the fourth via, and a second logic component coupled to the third and fourth contacts.

6. The apparatus of claim 5 , wherein the first logic component includes an input node coupled to the first contact and an output node coupled to the second contact, and the second logic component includes an input node coupled to the third contact and output node coupled to the fourth contact.

7. The apparatus of claim 1 , wherein the stack includes a first side on one side of a center axis of the stack and a second side on another side of the center axis, the first die includes a first portion on the first side of the stack and a second portion on the second side of the stack, and the first via of the first die is located on the first portion of the first die and the second via of the first die is located on the second portion of the first die.

8. The apparatus of claim 7 , wherein the second die includes a first portion on the first side of the stack and a second portion on the second side of the stack, and the fourth via of the second die is located on the first portion of the second die and the third via of the second die is located on the second portion of the second die.

9. An apparatus comprising:
a first die including a first via going through the first die, a second via going through the first die, a first contact coupled to the first via, and a second contact coupled to the second via; and
a second die arranged in a stack with the first die, the second die including a third via going through the second die, a fourth via going through the second die, a third contact coupled to the third via, and a fourth contact coupled to the fourth via; and
a conductive joint outside the first die and the second die and between the first die and the second die, the conductive joint coupled to the second and third contacts, wherein the first and fourth contacts are substantially aligned along a first line perpendicular to the stack, the second and third contacts are substantially aligned along another line perpendicular to the stack, and the first via, the first contact, the second contact, the conductive joint, the third via, the third contact, and the fourth contact form at least a portion of a connection coupled to the first and second die, and wherein no conductive joint outside and between the first die is coupled to the first and fourth contacts.

10. The apparatus of claim 9 , further comprising:
a third die arranged in the stack with the first die and the second die, the third die including a fifth via going through third die, a sixth via going through the third die, a fifth contact coupled to the fifth via, and a sixth contact coupled to the sixth via; and
an additional conductive joint outside the second die and the third die and between the second die and the third die, the additional conductive joint coupled to the fourth and fifth contacts.

11. The apparatus of claim 10 , further comprising:
a fourth die arranged in the stack with the first die, the second die, and the third die, the fourth die including a seventh via going through fourth die, an eighth via going through the fourth die, a seventh contact coupled to the seventh via, and an eighth contact coupled to the eighth via, wherein the additional conductive joint is a first additional conductive joint; and
a second additional conductive joint outside the third die and the fourth die and between the third die and fourth die, the second conductive joint coupled to the sixth and seventh contacts, wherein the conductive joint and the second additional conductive joint are substantially aligned in a direction perpendicular to the stack.

12. The apparatus of claim 11 , wherein the first die includes a first logic component having input and output nodes coupled to the first and second contacts, the input and output nodes arranged in a first direction, and the second die includes a second logic component having input and output nodes coupled to the third and fourth contacts, and the input and output nodes of the second logic component arranged in a second direction.

13. The apparatus of claim 12 , wherein the third die includes a third logic component having input and output nodes coupled to the fifth and sixth contacts, the input and output nodes of the third logic component and arranged in the first direction, and the fourth die includes a fourth logic component having input and output nodes coupled to the seventh and eighth contacts, the input and output nodes of the fourth logic component arranged in the second direction.

14. The apparatus of claim 9 , wherein the stack includes a first side on one side of a center axis of the stack and a second side on another side of the center axis, the first die includes a first portion on the first side of the stack and a second portion on the second side of the stack,

Assignees

• Micron Technology Inc

Inventors

• Keeth Brent

Classifications

• G11C5/06

  Arrangements for interconnecting storage elements electrically, e.g. by wiring · CPC title

• G11C5/02 Primary

  Disposition of storage elements, e.g. in the form of a matrix array · CPC title

• G11C7/20

  Memory cell initialisation circuits, e.g. when powering up or down, memory clear, latent image memory · CPC title

• G11C7/10

  Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers · CPC title

• G06F12/02

  Addressing or allocation; Relocation (program address sequencing G06F9/00; arrangements for selecting an address in a digital store G11C8/00) · CPC title