Apparatus and method for making a secured substrate
US-2024355722-A1 · Oct 24, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/04 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 917 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 66 |
| 2016 | 78 |
| 2017 | 82 |
| 2018 | 136 |
| 2019 | 128 |
| 2020 | 98 |
| 2021 | 90 |
| 2022 | 59 |
| 2023 | 65 |
| 2024 | 51 |
| 2025 | 54 |
| 2026 | 10 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Package architecture of scalable compute wall having compute bricks with vertically stacked dies
US-2024006395-A1 · Jan 4, 2024 · US
Thermal management of electronic components
US-9224672-B1 · Dec 29, 2015 · US
Controllable Integrated Capacitive Device
US-2015372155-A1 · Dec 24, 2015 · US
Semiconductor device with covering member that partially covers wiring substrate
US-2015364392-A1 · Dec 17, 2015 · US
Hidden plating traces
US-9209159-B2 · Dec 8, 2015 · US
Double-sided package
US-9209121-B2 · Dec 8, 2015 · US
Power semiconductor module having layered insulating side walls
US-9210826-B2 · Dec 8, 2015 · US
Methods of fabricating fan-out wafer level packages and packages formed by the methods
US-9202716-B2 · Dec 1, 2015 · US
Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package
US-9202789-B2 · Dec 1, 2015 · US
Ceramic combo lid with selective and edge metallizations
US-2015340298-A1 · Nov 26, 2015 · US
Perforated electronic package and method of fabrication
US-9196590-B2 · Nov 24, 2015 · US
Semiconductor chip and semiconductor device
US-9190378-B2 · Nov 17, 2015 · US
Semiconductor packages including electrical insulation features
US-2015325611-A1 · Nov 12, 2015 · US
Semiconductor package and wiring board having the semiconductor package thereon
US-9184146-B2 · Nov 10, 2015 · US
Sensor module
US-9177879-B2 · Nov 3, 2015 · US
Chip package and method of manufacturing the same
US-2015303178-A1 · Oct 22, 2015 · US
Semiconductor device and method of manufacturing the semiconductor device
US-2015303126-A1 · Oct 22, 2015 · US
Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package
US-2015303148-A1 · Oct 22, 2015 · US
Semiconductor assembly comprising chip arrays
US-2015287698-A1 · Oct 8, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/04?
- CPC H01L23/04 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/04 (Electricity)?
- Our database includes 917 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/04 growing?
- Publication counts under this code: 51 in 2024 vs 54 in 2025 (latest complete years).