Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2225/1058 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 3,190 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 175 |
| 2016 | 262 |
| 2017 | 337 |
| 2018 | 369 |
| 2019 | 409 |
| 2020 | 340 |
| 2021 | 257 |
| 2022 | 223 |
| 2023 | 246 |
| 2024 | 297 |
| 2025 | 241 |
| 2026 | 34 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Apparatus and method for making a secured substrate
US-2024355722-A1 · Oct 24, 2024 · US
Package structure and method of manufacturing the same
US-2024105664-A1 · Mar 28, 2024 · US
Semiconductor package using a coreless signal distribution structure
US-11869879-B2 · Jan 9, 2024 · US
Stub minimization using duplicate sets of signal terminals
US-9224431-B2 · Dec 29, 2015 · US
Stacked semiconductor package
US-9214403-B2 · Dec 15, 2015 · US
Stackable multi-chip package system
US-9202776-B2 · Dec 1, 2015 · US
Integrated circuit packaging system with connection structure and method of manufacture thereof
US-9202715-B2 · Dec 1, 2015 · US
Bump on pad (BOP) bonding structure
US-9196573-B2 · Nov 24, 2015 · US
Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars
US-9184103-B2 · Nov 10, 2015 · US
Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
US-9165910-B2 · Oct 20, 2015 · US
Semiconductor device having a semiconductor chip mounted on an insulator film and coupled with a wiring layer, and method for manufacturing the same
US-9153541-B2 · Oct 6, 2015 · US
Stacked packaging improvements
US-9153562-B2 · Oct 6, 2015 · US
Package 3D interconnection and method of making same
US-9129980-B2 · Sep 8, 2015 · US
Stackable molded microelectronic packages
US-9123664-B2 · Sep 1, 2015 · US
Fabrication method of semiconductor package
US-9117698-B2 · Aug 25, 2015 · US
Memory system topologies including a buffer device and an integrated circuit memory device
US-9117035-B2 · Aug 25, 2015 · US
Bonding package components through plating
US-9117772-B2 · Aug 25, 2015 · US
Semiconductor device and method of manufacturing the same
US-9112062-B2 · Aug 18, 2015 · US
In situ-built pin-grid arrays for coreless substrates, and methods of making same
US-9111916-B2 · Aug 18, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2225/1058?
- CPC H01L2225/1058 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2225/1058 (Electricity)?
- Our database includes 3,190 publications tagged with this CPC code.
- Is patent activity under CPC H01L2225/1058 growing?
- Publication counts under this code: 297 in 2024 vs 241 in 2025 (latest complete years).