Power-electronics packaging, interface and configuration
US-2025183111-A1 · Jun 5, 2025 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/8184 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 61 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 6 |
| 2017 | 6 |
| 2018 | 10 |
| 2019 | 6 |
| 2020 | 8 |
| 2021 | 3 |
| 2022 | 6 |
| 2023 | 4 |
| 2024 | 6 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic chip with connecting pillars for sintering assembly
US-2025087610-A1 · Mar 13, 2025 · US
Low pressure sintering powder
US-2024413117-A1 · Dec 12, 2024 · US
Power module package and manufacture method thereof
US-2024404958-A1 · Dec 5, 2024 · US
Low pressure sintering powder
US-12113039-B2 · Oct 8, 2024 · US
Semiconductor device and method for manufacturing the same
US-11967577-B2 · Apr 23, 2024 · US
Ultrafine-pitch all-copper interconnect structure and forming method thereof
US-2024113068-A1 · Apr 4, 2024 · US
Tapeless leadframe package with exposed integrated circuit die
US-11916090-B2 · Feb 27, 2024 · US
Interconnect structure for semiconductor with ultra-fine pitch and forming method thereof
US-11742316-B2 · Aug 29, 2023 · US
Joining and Insulating Power Electronic Semiconductor Components
US-2023215838-A1 · Jul 6, 2023 · US
Semiconductor device and method of manufacturing the same
US-2023215830-A1 · Jul 6, 2023 · US
Double-sided heat dissipation power semiconductor module and method of manufacturing the same
US-2023187309-A1 · Jun 15, 2023 · US
Interconnect structure for semiconductor with ultra-fine pitch and forming method thereof
US-2022415846-A1 · Dec 29, 2022 · US
Sintering a nanoparticle paste for semiconductor chip join
US-2022262754-A1 · Aug 18, 2022 · US
Sintering materials and attachment methods using same
US-11389865-B2 · Jul 19, 2022 · US
System and method for extreme performance die attach
US-11373976-B2 · Jun 28, 2022 · US
Semiconductor device and method for manufacturing the same
US-2022115347-A1 · Apr 14, 2022 · US
Tapeless leadframe package with exposed integrated circuit die
US-2022005857-A1 · Jan 6, 2022 · US
System and Method for Extreme Performance Die Attach
US-2021202433-A1 · Jul 1, 2021 · US
Assembly comprising hybrid interconnecting means including intermediate interconnecting elements and sintered metal joints, and manufacturing process
US-11011490-B2 · May 18, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/8184?
- CPC H01L2224/8184 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/8184 (Electricity)?
- Our database includes 61 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/8184 growing?
- Publication counts under this code: 6 in 2024 vs 3 in 2025 (latest complete years).