Electronic chip with connecting pillars for sintering assembly

Patent metadata

Field	Value
Publication number	US-2025087610-A1
Application number	US-202418825283-A
Country	US
Kind code	A1
Filing date	Sep 5, 2024
Priority date	Sep 8, 2023
Publication date	Mar 13, 2025
Grant date	—

Abstract

An electronic chip including a support and connection pillars, each connection pillar including a trunk including an end portion and an intermediate portion coupling the end portion to the support, and including a collar at the junction between the end portion and the intermediate portion.

First claim

1 . A method of manufacturing an electronic chip comprising a support and connection pillars, each connection pillar comprising a trunk comprising an end portion and an intermediate portion coupling the end portion to the support and comprising a collar at the junction between the end portion and the intermediate portion, the method comprising forming a first mask of photosensitive resin comprising, for each connection pillar, a first through opening, depositing the material making up the trunk in the first through openings, forming a second mask of photosensitive resin comprising a second through opening in the extension of each first through opening, and depositing the material making up the trunk in the second through openings.

2 . The method of manufacturing according to claim 1 , wherein the height of the end portion is between 10 μm and 100 μm.

3 . The method of manufacturing according to claim 1 , wherein the height of the intermediate portion is between 10 μm and 100 μm.

4 . The method of manufacturing according to claim 1 , wherein the difference between the maximum lateral dimension of the collar and the minimum lateral dimension of the end portion is between 1 μm and 7 μm.

5 . The method of manufacturing according to claim 1 , wherein the end portion comprises an end face on the side opposite the intermediate portion.

6 . The method of manufacturing according to claim 5 , wherein the end portion has a flared shape on the side of the end face.

7 . The method of manufacturing according to claim 5 , wherein the connection pillar comprises a finishing layer covering the end face.

8 . The method of manufacturing according to claim 1 , wherein the trunk is made of copper.

9 . A method of assembling an electronic chip manufactured according to the method of manufacturing according to claim 1 to another electronic chip or to a package, comprising penetrating the connection pillars into a layer of sinter paste at least up to the collar of each connection pillar, removing the connection pillars from the layer of sinter paste, a block of sinter paste remaining attached to each connection pillar at least over the height of the end portion, preferably over a height equal to 50 μm, depositing the electronic chip on the other electronic chip or on the package, and heating to obtain sintering of the blocks of sinter paste.

10 . The method of assembling according to claim 9 , wherein, during heating to obtain sintering of the blocks of sinter paste, there is no pressure exerted on the electronic chip.

11 . The method of assembling according to claim 9 , wherein the amount of paste to be sintered after bonding, between each connection pillar and the other chip or package, is greater than 4 μm, preferably between 7 μm and 15 μm.

Assignees

• Commissariat A Ienergie Atomique Et Aux Energies Alternatives
• Centre Nat Rech Scient
• Univ Bordeaux
• Inst Polytechnique Bordeaux
• Univ Bordeaux 1

Inventors

• Feautrier Céline
• Souriau Jean-Charles
• Gougeon Julie
• Treguer-Delapierre Mona

Classifications

• H10W72/01255

  by using masks · CPC title

• H10W72/01215

  forming coatings · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W72/223

  characterised by the structure of the outermost layers, e.g. multilayered coatings · CPC title